4.15-17深圳见!上海新球携色玢墨水&WIN16800亮相WEPACK 2D20

本次展会，我们将重点呈现：

一、革命性打印材料矩阵，引领行业革新

我们致力于提供全面的打印色彩解决方案，本次将展出覆盖多领域的优质产品，包括：

• 主推明星产品：色玢（Dyement）高分子新材料。

这是一款突破性的高分子材料（非传统颜料或染料），实现了真正意义上的“全防水”打印效果，为您解决长久以来的行业痛点。

• 完备产品系列：

同时展出半防水染料墨水、防水防晒颜料墨水、水性色玢色浆、无盐喷墨染料、喷墨颜料色浆等，全面满足不同用户对色彩、耐久性及适配性的多样化需求。

二、智能打印设备登场，打造瓦楞印刷新范式

现场将重磅展示新篁WIN系列WIN16800高速瓦楞数码印刷机。作为传统水性印刷设备的理想升级之选，该设备集无版印刷技术、富士星光高精度压电喷头、适配瓦楞行业的专属数码软件平台，搭配我们自研的水性环保色玢（Dyement）墨水于一体，全方位赋能包装生产，实现高速高效作业、色彩精准一致，更能以更高利润承接小订单、大幅降低打印成本，相较传统水性印刷更具核心竞争力，为您带来品质、效率与效益兼具的专业印刷体验。

At this exhibition, we’ll feature two key highlights:

一. Revolutionary Printing Material Portfolio, Leading Industry Innovation

We provide complete printing color solutions for every need. This time, we’ll display a wide lineup of high-quality products covering multiple applications, including:

• Star Product:Dyement Polymeric New Material

A true breakthrough material (not traditional pigment or dye) that delivers full waterproof printing, solving long-standing pain points in the packaging industry.

二. Smart Printing Equipment, Redefining Corrugated Printing

We’re proud to present the SHINEWIN WIN Series WIN16800 High-Speed Digital Corrugated Printing Press live on site.As the ideal upgrade for traditional water-based printing equipment, it integrates plateless printing technology, FUJIFILM StarFire high-precision piezoelectric printheads, a corrugated-industry-specific digital software platform, and our own eco-friendly water-based Dyement ink, This powerful combination boosts your packaging production with high speed, great efficiency and consistent, accurate color. It helps you win higher profits from small orders and cut printing costs greatly, giving you stronger competitiveness over traditional water-based printing. In short, it brings you professional printing performance that balances quality, efficiency and profitability.

2026 WEPACK世界包装工业博览会，将于4月15-17日在深圳国际会展中心（宝安）举办。作为覆盖包装全产业链的年度盛会，本次展会汇聚1500+优质展商、10万+行业观众，联动8大主题展同期举办，是全球包装领域技术交流与贸易合作的核心平台。

本次展会聚焦「轻量化、可持续、数字化」三大趋势，为行业带来从原辅材料、智能设备到成品解决方案的全链路展示，助力企业链接全球资源、把握市场新机遇。

2026 WEPACK World Expo of Packaging Industry will take place from April 15 to 17 at Shenzhen World Exhibition & Convention Center (Bao'an). As an annual flagship event covering the entire packaging industry chain, the expo brings together over 1,500 leading exhibitors and 100,000+ industry visitors, featuring 8 themed exhibitions running concurrently. It serves as a core platform for technical exchanges and trade cooperation in the global packaging sector.

Focusing on the three major trends of "lightweight, sustainability and digitalization", the expo showcases the full industry chain, from raw materials and intelligent equipment to finished solutions, helping enterprises connect with global resources and seize new market opportunities.

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